Home Scholarships Bond University Scholarship 2024/2025

Bond University Scholarship 2024/2025

Bond University

Bond University Scholarship 2024/2025 | Application Process

Bond University Scholarship 2024/2025 – Elevate Your Academic Journey!

Embark on a transformative educational experience with the Bond University Scholarship for the academic session 2024/2025 in Australia. This fully funded opportunity invites international students to pursue their Bachelor’s Degree, providing a 50% tuition fee waiver.

Key Information:

  • Application Period: Open for the 2024/2025 academic session.
  • Eligibility: All eligible and enthusiastic applicants are encouraged to apply online before the respective deadlines.

Bond University Scholarship Highlights: Situated on Australia’s Gold Coast, Bond University is offering partially funded scholarships for international students seeking undergraduate degrees. This scholarship provides recipients with a remarkable 50% tuition fee waiver, emphasizing academic excellence and Bond University’s commitment to outstanding global students.

Why Choose Bond University?

  • High Academic Standards: Recognition and support for international students demonstrating academic excellence.
  • Global Excellence: A testament to Bond University’s commitment to quality and fostering outstanding talent.
  • Undergraduate Excellence Scholarships: Awarded based on academic merit, showcasing Bond University’s dedication to exceptional students.

Scholarship Description:

  • Institution: Bond University
  • Study Level: Undergraduate
  • Location: Australia
  • Opportunity Focus Areas: Various disciplines; refer to the provided checklist.
  • Program Period: Four years
  • Deadline:
    • Applications closed on 12 June 2024 for students starting in the September 2024 Semester.
    • Applications close on 16 October 2024 for students commencing in the January 2025 Semester.

Courses Offered: Explore a diverse range of undergraduate programs across disciplines, including but not limited to:

  • Actuarial Science
  • Architecture and Built Environment
  • Business and Commerce
  • Communication and Creative Media
  • Health Sciences
  • Hotel and Tourism
  • International Relations and Humanities
  • Law
  • Sport
  • Academic & English Pathways
  • Executive Programs For a comprehensive list of programs, visit the Bond University website.

Scholarship Coverage: The Bond University Scholarship provides recipients with the following benefits:

  • 50% tuition remission for the chosen undergraduate program.
  • Note: Some programs, such as Master of Psychology, Study Abroad and Exchange Programs, Bachelor of Medical Studies, and Doctor of Physiotherapy, are not eligible for consideration.

Eligibility Criteria: Applicants must meet the following criteria to be eligible for the Bond University Scholarship:

  • Hold an offer from Bond University to commence an undergraduate degree.
  • Currently reside outside of Australia.
  • Demonstrate outstanding academic ability.
  • Not have commenced undergraduate or postgraduate studies at Bond University.
  • Complete and submit the Undergraduate Excellence Scholarship Application Form by the relevant deadline.

Seize this exceptional opportunity to join Bond University, where academic excellence is celebrated, and global talent is nurtured. Apply now to shape your future with a 50% tuition fee waiver!

Top of Form

How to Apply For Bond University Scholarship

Visit the official website of Bond University Scholarship below for the application form and other information about the Bond University Scholarship program.

Please follow the following application instructions to win Bond University Scholarships:

  1. Complete the Bond University Online Application Formto receive their program offer before applying for this scholarship.
  2. Once an offer has been received, students must complete the Undergraduate Excellence Scholarship Application Form. The form must be completed in full and returned to international@bond.edu.auby the relevant application closing date.


Please enter your comment!
Please enter your name here